Welcome to VLSIA 2026

12th International Conference on VLSI and Applications (VLSIA 2026)

September 26 ~ 27, 2026, Toronto, Canada

Hybrid--Registered authors can present their work online or face to face New

Program Committee

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Accepted Papers

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Toronto, Canada

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Scope

The 12th International Conference on VLSI and Applications (VLSIA 2026) serves as a premier global forum for researchers, practitioners and industry experts to exchange knowledge, present innovations, and discuss emerging trends in Very Large Scale Integration (VLSI). The conference brings together leading contributors from academia and industry to advance the theory, design methodologies, tools, and practical applications that define the future of integrated systems.

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Call for Papers


VLSIA 2026 invites original, unpublished research contributions that explore significant advances across the broad spectrum of VLSI. Submissions may include theoretical developments, experimental results, prototype demonstrations, industrial case studies, and comprehensive survey articles. The conference welcomes work illustrating progress in Computer Science, Engineering, and Applied VLSI Technologies , reflecting the rapidly evolving landscape of semiconductor design and systems integration.

By fostering dialogue across these diverse yet interconnected domains, VLSIA 2026 aims to accelerate innovation, inspire collaboration, and shape the next generation of VLSI systems and applications.

Topics of interest include, but are not limited to, the following


  • Advanced Digital, Analog, Mixed Signal and RF Circuits
  • Low Power, Energy Efficient and Always On Circuit Techniques
  • High Speed I/O, SerDes and Optical I/O for AI Systems
  • Emerging Memory and Storage Technologies
  • TinyML and Ultra Low Power AI Hardware
  • Chiplet Architectures, UCIe and Multi Die Systems
  • Chiplet Reliability, Thermal and Power Integrity
  • 3D IC, 2.5D Integration and Advanced Packaging
  • RISC V Architectures and Custom ISA Extensions
  • CXL Hardware, Memory Pooling and Disaggregated Computing
  • AI/ML Accelerators and Systolic/Matrix Engines
  • LLM Specific Hardware (Transformers, KV Cache Engines)
  • In Memory and Near Memory Computing
  • Neuromorphic and Brain Inspired Hardware
  • Reconfigurable, Dataflow and FPGA Architectures
  • Machine Learning for EDA and AI Driven Physical Design
  • AI Generated Hardware (LLM Generated RTL and Constraints)
  • LLM Assisted Verification and Automated RTL Debug
  • Advanced CAD, Formal Verification and Post Silicon Validation
  • Hardware Security, Trusted Computing and Secure SoCs
  • PUFs, Secure Key Generation and Anti Tamper Hardware
  • Side Channel and Fault Injection Resistance
  • Chiplet and Multi Die Security
  • 6G, mmWave and THz Circuits
  • Photonics, Optical Interconnects and Co Packaged Optics
  • Sensor Interfaces, Biomedical and Mixed Domain Circuits
  • Advanced CMOS Nodes (GAA, CFET, Nanosheet)
  • Backside Power Delivery Networks (BSPDN)
  • Post CMOS Devices (CNTFET, TFET, Spintronics)
  • Reliability, Aging, Variability and Soft Error Resilience
  • Design for Manufacturability, Yield and Sustainable Semiconductor Manufacturing
  • Quantum and Cryogenic CMOS Circuits
  • Bio Electronics, Lab on Chip and Implantable Systems
  • Nano Scale Devices and Emerging Nanotechnologies
  • Green Computing Hardware and Carbon Aware Design

Paper Submission

Authors are invited to submit papers through the conference Submission System by July 11, 2026 . Submissions must be original and should not have been published previously or be under consideration for publication while being evaluated for this conference. The proceedings of the conference will be published by Computer Science Conference Proceedings in Computer Science & Information Technology (CS & IT) series (Confirmed).

Selected papers from VLSIA 2026, after further revisions, will be published in the special issue of the following journal.

Important Dates

Submission Deadline

July 11, 2026

Authors Notification

July 31, 2026

Registration & camera - Ready Paper Due

August 08, 2026

Proceedings

Hard copy of the proceedings will be distributed during the Conference. The softcopy will be available on AIRCC Digital Library

Sponsors